标签：#hardware

If Nvidia has cracked a way to bring AI agents easily, safely and usefully to the masses, it could — and should — be big.

Intel Foundry's Rio Rancho Facility Moves Toward Glass Substrate Volume Production Reports from Wccftech and Forbes (May 26, 2026) indicate that Intel Foundry's facility in Rio Rancho, New Mexico, is advancing toward becoming the world's first factory to achieve mass production of glass substrates — a next-generation chip packaging technology considered critical for scaling AI hardware beyond current organic substrate limitations. The facility has already begun manufacturing silicon photonics products for external customers and is expected to play a central role in Intel's advanced packaging strategy. Why Glass Substrates Matter for AI Glass substrates address fundamental limitations of current organic (ABF) substrates that are becoming bottlenecks for AI chip scaling: Extreme flatness (<1 μm warpage) enables larger die and chiplet assemblies Low CTE (3-8 ppm/°C) closely matches silicon (2.6 ppm/°C), reducing thermal stress Higher interconnect density due to dimensional stability Better high-frequency performance with low dielectric loss Larger format supporting bigger interposers than organic substrates For AI accelerators that already push CoWoS substrate limits at 5,500+ mm², glass substrates could enable even larger multi-chiplet assemblies. Intel's Advanced Packaging Ecosystem Intel has been building an advanced packaging portfolio: EMIB (Embedded Multi-die Interconnect Bridge): High-density die-to-die connections Foveros : 3D stacking for logic-on-logic packaging Co-Packaged Optics (CPO) : Recently demonstrated glass-core substrate prototypes with CPO Customer Base According to Forbes: Existing customers : AWS, Cisco Reportedly in discussion : Apple, Google, Microsoft, Nvidia, Tesla Commercial Timeline Milestone Timeline Glass substrate R&D announcement 2023 Pilot line (Chandler, AZ) 2024-2025 Silicon photonics production (Rio Rancho) 2026 (active) Glass substrate volume production ~2028-2030 Global Competition Intensifying SKC/Absolics (Korea): Operating pilo

Meta seems to be making big bets on AI-powered hardware.

The Ninja Artisan Outdoor Pizza Oven is aimed at people who want delicious pizza nights without having to deal with things like propane or wood pellets, unlike many other pizza ovens.

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If you're looking for a fun way to connect with nature while collecting bird species on an app like Pokémon, give this smart feeder a try.

Europe, Australia, and Asia can still get it while the getting's good.

The ring is 40% smaller than its predecessor, and comes with more accurate sensing, enhanced battery life, and more.

Built on top of the open-source Hermes project, Vertu's new foldable combines AI-agent workflows, enterprise integrations, and ultra-premium luxury finishes.

What if a development board could be as friendly as an Arduino, yet powerful enough to drive industrial-grade robots? That is exactly the gap the new G2 Nano sets out to close. Most hobby boards handle simple robot builds with ease, but they hit a wall once a project demands tight, simultaneous control of several motors. Embedded systems engineer Ryan Strace noticed that the custom controllers built for these complex machines tend to look remarkably alike, with motor coordination as the recurring headache. Rather than reinventing that hardware on every project, he designed a single accessible platform to handle it, and the G2 Nano is the result. Precise motor control usually leans on closed-loop techniques like PID, but real-world gremlins such as integrator windup, sensor noise, mechanical saturation, and phase delay can all degrade performance. Robots also need smooth multi-axis motion with managed acceleration to avoid jerky, stressful movement, plus solid fault handling so an unexpected state does not wreck expensive parts. Strace is tackling all of this with a low-cost motion-control IC he is developing, and the G2 Nano is the high-performance platform built to prove out that future chip. What's under the hood Processor: NXP Arm Cortex-M7 clocked at a brisk 1 GHz Wireless: u-blox MAYA-W1 module with dual-band Wi-Fi and Bluetooth Motion sensing: six-axis IMU (3-axis accelerometer plus 3-axis gyroscope) and a dedicated magnetometer for compass heading Form factor: just 0.8 by 3 inches, breadboard-friendly, on a six-layer PCB stackup for clean high-speed signals On the software side, the board targets native micro-ROS and the Zephyr real-time operating system, with planned MicroPython support so you can prototype in Python without paying the usual speed penalty, thanks to that unusually high clock. Every design file and document is open-source and published on GitHub. Build it yourself If you want to follow along, the core ingredients are clear: an NXP Cortex-M7 a

SOND introduced its debut product: Dreambuds, a closed-loop, in-ear system that captures 12 physiological signals from the wearer, then acts on them in real time to help consumers get better sleep.